Module contributors

This module has had the benefit of an enormous amount of input from all sectors of the industry; suppliers of materials, manufacturers of equipment, board fabricators and circuit assemblers. We hope that most of the companies and people who have provided material have been listed below, and apologise for any omissions, which are unintentional.

A number of people in our list are colleagues from various support organisations. Some are publicly funded, whilst others are commercial organisations; all are heavily committed to making lead-free implementation a success. We would particularly like to thank Soldertec for making much information freely available to us, as well as their continuing promotion of international conferences on lead-free.

Agilent Technologies "" John Lau
AIM "" David Suraski
Atotech "" Alan Stirling
Roger Bilham Consultancy Roger Bilham
Celestica ""
Circatex ""
Concoat "" Graham Naisbitt
Dage Precision Industries "" David Bernard
DEK Printing Machines "" Alan Hobby
John Stirling
Dionics "" Paul Chinery
DKL Metals "" Ron Gow
Electronic Presentation Services "" Bob Willis
ERA Technology "" Paul Goodman
Heller Industries ""
Henkel Loctite Adhesives "" Steve Dowds
MacDermid "" Alan Hanson
Merlin Circuit Technology "" Dennis Price
Metcal "" Simon Hawkins
Multicore Solder "" Gordon Clark
Malcolm Warwick
National Physical Laboratory "" Alan Brewin
Chris Hunt
Colin Lea
Open University "" Bill Plumbridge
PACE Microsystems ""
ROHM Electronics "" Angus Westwater
Sanmina-SCI ""
Scottish Advanced Manufacturing Centre "" Tom Dearie
Seho UK "" Pete Bagshaw
Senju Manufacturing (Europe) "" Martin Allison
Shipley Chemicals "" Martin Goosey
SMART Group ""  
Soldertec "" Kay Nimmo
Tom Perrett
Solectron Scotland "" Steve Mainwaring
Vitronics-Soltec ""
X-Tek Systems "" Steve Hursey

As module author, I have been very much influenced by my teaching at the Scottish Advanced Manufacturing Centre in Livingston, and by my learning at the hands of many experts brought to the many workshops and conferences I have attended that have been organised by the SMART Group. Where would surface mount be without our industry champions?! If you aren’t already a member, then you should seriously consider joining; membership is available at affordable prices for both individuals and companies.

Those who have visited Nepcon, or any of the main SMART events, will recognise Bob Willis, the SMART Technical Director, and a well-known consultant in the assembly field. The images and videos that he has made available for this module have helped enormously in putting the points across. Look out for Bob in his many regular columns in the trade press, and use his web site as a resource for your ongoing study.

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