In this paper we are examining two closely-related methods for depositing significant quantities of viscous fluids (solder paste; glue; solder mask; legend ink) onto a surface in one stroke. The processes generally use the same equipment, although with different settings, the machine being widely referred to as a “screen printer”, even if actually used only for stencil printing. A rich source of confusion, which comes from the fact that the technology we use was derived from silk screen printing, an art process first developed during the nineteenth century, and today still employed for printing tee-shirts as an alternative to applying transfers.
Both screen and stencil processes use a squeegee to press the fluid through defined openings (usually called ‘apertures’) in an image carrier (the stencil or screen) and onto the work-piece. It is the carrier that determines the pattern and also meters the amount of material deposited. The key difference between the processes is that:
In consequence, there is a difference in the way the printer is set, the image carrier being held in contact with the work-piece throughout the print stroke during stencil printing, but slightly out of contact during screen printing.
From the user perspective, the main differences are that:
The last three differences explain why stencil printing is now the method of choice for almost all solder paste printing, and the first two why you will still encounter screen printing in board fabrication, for tasks such as screening solder mask and legend. Here the patterns are more complex than with solder paste, covering a larger percentage of the board area, and the materials used have finer particles and are less viscous.
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In screen printing, the screen employed as an image carrier consists of a rigid frame on which is stretched a mesh (or ‘gauze’) made from fine polyester or stainless steel wires. The mesh acts as a support for a stencil of the required image, which is produced in a photosensitive emulsion applied to the mesh. Emulsion is normally applied to both sides of the mesh, and ‘built up’ to a defined thickness on the underside (the side in contact with the board).
Figure 1 shows the starting position of the printer: the screen is fixed just above the board, and the ‘medium’ (ink or glue, for example) lies in front of the flexible squeegee. The mesh of the screen is pushed down into contact with the board by the squeegee as it moves across the screen, rolling the medium in front of it.
The squeegee blade first presses the medium into the open apertures of the image, and then removes the surplus as it passes across each aperture. The screen then peels away from the printed surface behind the squeegee, leaving the medium that was previously in the mesh aperture deposited on the board beneath (Figure 2). The medium flows slightly immediately after printing to reduce the ‘mesh marks’ left in the print, a process known as ‘levelling’.
The process is sometimes referred to as being ‘off-contact’ printing, since the screen only contacts the printed surface at the point where the squeegee passes over it. A typical value for this ‘snap-off distance’ is 0.5 mm for each 100 mm of frame width.
Emulsion is normally applied to both sides of the mesh, and ‘built up’ to a defined thickness on the underside (the side in contact with the board). The total thickness of the emulsion mask and the mesh determines the thickness of material deposited. As a rough rule-of-thumb, the print thickness will be approximately two-thirds of the overall mesh-plus-emulsion thickness.
In contrast to screen printing, stencil printing is an ‘on-contact’ (or ‘in-contact’) process. The stencil is a metal mask which rests directly in contact with the surface of the board. In stencil printing, the board is moved into contact with the stencil before the squeegee starts to move (Figure 3). When the squeegee has completed its stroke, the board and stencil are then separated vertically, which releases the paste from the stencil, producing well-defined edges to the print. It is usual, but not essential, for the stencil to remain fixed and the board to be raised for printing and lowered at a controlled speed afterwards.
The process depends on the interaction of several factors:
If one of these factors is incorrect, printing quality will be poor, and therefore the printer itself is only one of the decisive factors in the whole process. The process window (the region where process values can vary but still produce good results) can be enlarged by careful choice of materials and design.
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Stencils for solder paste printing are normally bought in from specialised manufacturers. The starting point is the PCB layout CAD data, which is used to define the size and position of openings, allowing for the intended size differences between lands and stencil openings. The stencil manufacturer then has to include other corrections for the tolerances of the processes being used.
A complete stencil consists of a square or rectangular rigid frame to which the stencil is attached. The frame design is specific to the printer to be used, and is most commonly fabricated from square aluminium tube for the optimum combination of rigidity and lightness, although cast aluminium frames are used for small printers.
Most frequently, a polyester mesh is laid on the frame with its filaments at 45° to the frame, tensioned and then glued to the frame, the metal stencil is glued on this mesh, and the mesh is cut away from the central printing area (Figure 4). The mesh is often filled with emulsion to make it impermeable to solder paste. Metal stencils are, however, sometimes directly glued to the frame. Tensioning is also required in this case to ensure a taut, flat surface.
The stencil frame evidently takes more room to store than would a separate stencil foil. A number of removable foil systems have been developed so that stencils can be stored separately from frames.
In the original implementation of this idea, the stencils were stretched in only one direction, corresponding to the print stroke direction of the printer. The advent of vector printing, which attempts to improve solder release by using a squeegee at an angle to the print, has led to the development of methods for tensioning the stencil in both axes.
The stencil foil itself may be made by one of three manufacturing techniques: etching, laser cutting and electroforming.
Chemically etched stencils are usually produced either from brass (which may subsequently be nickel plated) or from an etchable grade of stainless steel. Brass will yield sufficiently to allow printing on surfaces which are less than perfectly flat. Stainless steel is more expensive, but has improved durability. In the US stencils made from molybdenum are used, but these are not popular in Europe.
The process is shown schematically in Figure 5. A resist is applied to the stencil material and the apertures are photographically defined. The resist is then ‘developed’ to remove unexposed areas, and the apertures thus opened up are chemically etched.
The artwork dimensions are not the same as those of the openings to be made because the etchant ‘undercuts’ the photoresist, so there is an inevitable degree of over-etching. The artwork is therefore modified by the stencil manufacturer (a process known as ‘wobbling’) to reduce the aperture sizes to compensate for this. The wobbling process, in combination with etching, produces the rounded corners which are characteristic of etched stencil apertures.
Etching is carried out from both sides of the foil in an attempt to produce near-vertical side walls. This double sided process can create a ‘waist’ within the aperture, although this can be reduced by electro-polishing.
Etching is the least expensive manufacturing method, but the practical lower limit for aperture dimension is the thickness of the material (150µm). Etching is also the least accurate method in terms of aperture positioning, and it is difficult to produce a quality stencil with openings for components with pitches smaller than 0.5mm. Nevertheless, except for fine-pitch applications, the majority of stencils are produced in this way.
The laser cutting process produces stencils directly from the PCB CAD data, with no intermediate steps, such as photoplotting (Figure 6). The aperture data for the stencil is modified to allow for the width of the laser beam, and fed directly to the laser cutting machine. Size and positioning are therefore very accurate, and laser cutting can be used for component lead pitches down to 0.3mm. The limitation then is due to the aspect ratio of the hole: where the aperture is smaller than about 1.5x the stencil thickness, paste release is impaired.
The laser cutting operation is carried out from the bottom side of the stencil (board-side during printing), to ensure that the slight taper introduced by the cutting process opens out towards the board. This is claimed to enhance solder paste release during printing. However, the square corners typical of laser cut apertures are believed by some users to make cleaning more difficult.
The stencil material is almost always stainless steel, and the grades used can be substantially more robust than for etching, where a fine grain is mandatory. By contrast, laser cutting takes no account of grain boundaries, and operates well even for annealed materials.
Another advantage of the technology which is used by some assemblers is that the stencil can be cut from measurements of an actual board, rather than the artwork from which it was generated. This compensates for any inaccuracies in board manufacture.
Laser cut stencils are produced using CAD data, so size and positioning are very accurate and modification is easy. However, since laser cutting is a serial process, with apertures formed one at a time, the price of a laser cut stencil is high, particularly for a densely-packed board.
Electroformed stencils are made of nickel, by an ‘additive’ electrochemical process, in contrast to the ‘subtractive’ process of etching and laser cutting. Photoresist is applied to a metal base plate and exposed through a photoplot of the aperture pattern (Figure 7).
After processing, a resist pattern is left only where apertures are required. A plating process builds up nickel to the required thickness around the resist areas. The resist is removed and the electroformed stencil separated from the metal base.
The advantage of this type of stencil is the extreme smoothness of the aperture walls which results in easier flow of the paste into the aperture during printing, and possibly lower adhesion of the paste to the walls during release. A slight tapering of the stencil walls is also present.
A side effect of the manufacturing process is that electroformed stencils provide a small gasket around each aperture which helps reduce paste bleed onto the underside of the stencil. One user reported reducing the need to clean the underside of the stencil from once every five prints to once every thirty.
The cost of an electroformed stencil is between that of an etched and a laser cut stencil, and its accuracy is similar to etching.
The most commonly specified stencils are etched from stainless steel 150µm (0.006in) thick. Other standard thicknesses are 200µm (0.008in) and 125µm (0.005in), the latter for fine-pitch applications. Molybdenum is a candidate for very fine pitch slots needing 100µm (0.004in) thick stencils, but the resulting paste volume is only rarely sufficient to create satisfactory joints over the whole.
Etching, often in combination with laser cutting, is used to produce stepped stencils, partially etching areas around apertures where a thinner than normal deposit is required. This construction enables solder paste deposits of different thickness to be produced simultaneously for different types of components – for example, a reduced thickness may be required at fine-pitch component locations, in order to improve print definition, or a thicker deposit needed for components such as through-hole connectors. When a number of different thicknesses are produced on a single foil, this is sometimes referred to as a ‘multi-level’ stencil (Figure 8).
Although stepped stencils are more expensive, the attraction is that the same stencil can be used for printing paste volumes suitable for both large surface mount components and fine-pitch leads. Despite concerns that such a stepped stencil would only be ‘cleared’ by a compliant squeegee, squeegees of both hard rubber and metal have been proven in practice, provided that the stencil profile is correct, the areas of reduced thickness are not too small, and an allowance is made for a transitional area (2–3 mm width), as squeegees do not cope well with a sharp transition.
Stencils are generally satisfactory for printing solder paste for chip components down to the smallest passive component sizes and for integrated circuits with lead spacing down to 0.4mm. Below this level, the deposit usually becomes too thick and excess paste is a major problem, arising largely from the impracticality of reducing stencil thickness below 100µm.
Laser-cut stencils are usually more consistent than etched equivalents in their control of aperture dimensions. This is partly because suppliers have been slow to recognise the importance of using cross-rolled material to ensure regular grain shape in X and Y directions, or else have difficulty in etching these tougher materials. There is always a slight taper in etched apertures, depending on the metal thickness and whether etching is from one or both faces: the latter gives better results and is customary except for stepped stencils.
The apertures in a stencil are, ideally, designed to be slightly smaller than the corresponding pads, with the aim of getting a bleed-resistant seal between the pad surface and the underside of the stencil. In practice, for the smallest pads, the need to have a sufficient paste area makes this difficult to achieve.
There has been much debate as to what is the best finish for aperture walls to aid paste release, ensuring that all the paste is released from each aperture. This has become more difficult with reducing pad sizes. Competing claims for promoting paste release are made for:
One school of thought advocates a degree of roughness on aperture walls as an aid to reliable paste transfer, using the analogy of wet sand in a child’s seaside bucket: ‘If the bucket walls are smooth, it can be difficult to get the sand out; if the walls were corrugated, the sand would be more easily ejected.’
As laser cutting produces a comparatively rough wall finish, it is not surprising that manufacturers of laser cut stencils favour this less than perfectly smooth wall approach! Alpha Sigma Technology stencils are subjected to a proprietary side-wall preparation process, in which small indentations are provided to retain small amounts of the paste vehicle and so ‘lubricate’ the paste’s passage through the aperture. This is analogous to high performance car engines, where the cylinder walls have minute indentations to retain lubricating oil.
In the final analysis, there is no substitute for evaluating different stencil types for the specific application, particularly for fine-pitch work.
What methods are used for manufacturing stencils for solder paste printing? Draw up a table comparing all three methods, explaining briefly:.
The useful life of a stencil varies considerably, depending on complexity, stencil size and thickness and the distance between apertures. Based on his experience as a contract assembler, Boswell reports that stencils last between 5,000 and 50,000 prints, but much longer lives have been reported by OEMs. In all kinds of company, the life of a stencil is frequently cut short by damage during handling.
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Screen printing uses relatively soft polyurethane rubber squeegees, as these:
Note that the presence of mesh prevents flexible squeegees entering the apertures and scooping out paste.
In stencil printing, either polyurethane rubber (‘polymer’) or metal squeegees may be used.
In stencil printing, a soft squeegee blade will accommodate uneven boards, but its flexibility will also deflect into the apertures and scoop out the paste which has just been printed. A soft rubber squeegee is also prone to wear, and its lack of a sharp, square edge will give relatively poor print definition.
Hard, polyurethane rubber with limited flexibility gives improved print definition and longer life, but needs high pressure to clean the stencil surface of paste. If machine settings are incorrect, a hard squeegee may ‘coin’ the stencil surface, leaving an impression of the board outline in the stencil foil.
There are a number of types of polymer squeegee including both trailing and diamond-shaped. Usually two squeegees will be fitted back to back as shown in Figure 9, in order to make it possible to print on both forward and return strokes, with the squeegee assembly ‘hopping over’ the pile of paste. This is preferable to having to return the paste roll manually to its start position.
All rubber squeegees will deform to some extent, resulting in what is known as ‘scoop’ or ‘scavenging’. This effect is illustrated in Figure 10. The result is a reduced volume of solder paste, leading to ‘insufficients’ and ‘opens’.
By contrast, the transverse stiffness of a metal squeegee prevents the blade from bending into a solder pad opening because the squeegee is supported on both sides of the pad. It rides along the stencil surface and shears the solder paste in the plane of the top surface of the stencil, but without dipping into and scavenging solder paste from the apertures.
Provided that both board and stencil are flat and accurately parallel to each other and to the plane of motion of the squeegee, metal squeegees not only give good definition, but can also operate at lower pressure than hard rubber squeegees. This lower pressure reduces bleeding where solder is forced out at the bottom of the aperture, past the seal between stencil and pad, leading to solder bridging after reflow.
Experiments by Intergraph reported that, compared against a polyurethane squeegee, the solder pads produced by a metal squeegee:
The metal squeegee was also reported to leave a more consistent paste deposit whether the pads were parallel or perpendicular to the squeegee motion, and to be more forgiving of variations in squeegee pressure, solder paste, and board to substrate alignment. 18% fewer printing defects have been cited by one high volume manufacturing operation.
These effects are just as important in non-fine-pitch printing applications, where large apertures make polymer squeegee deflection even more of a problem, although manufacturing tolerances are wider.
Unexpectedly, experience has shown that metal squeegees are compatible with stepped stencils, with excellent printing results reported when 3mm is allowed for each 50µm of step-down.
The higher friction between a bare metal squeegee and stencil can result in stencil wear. Early non-durable finishes provided good performance only for a short working life, but highly adherent, wear-resistant polymer coatings have now been developed by companies such as Transition Automation. In these, the lubricated edge is metallurgically bonded to the squeegee base material rather than plated, so that the lubrication lasts as long as the squeegee. This allows the squeegee to slide smoothly on the stencil surface with less friction than a polymer squeegee. Reduced friction leads to reduced registration shifts which in turn improves output quality. Decreased stencil movement during printing, particularly during acceleration, extends the life of the stencil. The lubricated edge also serves to prevent stencil scratching.
Metal squeegees are more durable than polyurethane rubber blades. High volume manufacturing operations may change polymer squeegees as often as once a day, whereas metal squeegees may last for over 100,000 prints. More significantly, the printing quality of a polymer squeegee reduces because the topology of the edge changes as the squeegee is abraded by friction with the stencil and corroded by contact with solder paste. These effects are not visible on the surface of a metal squeegee, even after many print cycles.
So, while metal squeegees can cost 5–15 times as much as polymer units, they are often justified on the basis of higher throughput, lower sensitivity to printing variables, and higher output quality. However, operators must be careful when handling metal squeegees, as they ‘do not bounce when dropped’, and for that reason it has been commented that ‘the life of a metal squeegee can be less than one print’!
Metal squeegees work well with metal stencils. They are, however, not recommended for traditional screen printing, since they can damage both the polymer mask and the underlying mesh.
Describe the advantages and disadvantages of soft rubber, hard rubber, and metal squeegees for stencil printing solder paste.
What type of squeegee would you choose for an assembly containing many fine-pitch parts on a small board?
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The printing process was illustrated in Figure 2. As we saw, it starts with the application of paste to the stencil, and then involves four main activities:
The first three of these activities take place while the squeegee moves across the stencil, apertures being progressively filled and the paste sheared flat until the whole stencil pattern has been filled.
To understand the printing process, we need to think of the forces acting on the squeegee, stencil and paste. The paste acts as a fluid, transmitting hydrodynamic pressure applied to it and being forced through the apertures by pressure from the squeegee.
The forces acting on the paste and stencil are shown in Figure 11 and Figure 12. As the squeegee is moved across the stencil, the rolling resistance of the paste exerts an upward pressure on the squeegee. The magnitude of this lift force depends on the viscosity of the paste, the speed of the squeegee, and the angle of the blade. The pressure applied to the squeegee must overcome this lifting force in order to fill the apertures and clean the top surface of the stencil.
The paste is ‘levelled’ by the squeegee cleaning the top surface of the stencil, and its cleanliness is an indicator of stencil printing quality. The major influences are squeegee pressure and speed.
Note, however, that there is a ‘process window’ for squeegee pressure, with bleeding also occurring if the pressure is insufficient to create a seal between board and stencil, and that a similar effect is produced by stencil damage.
Using a diagram to show the forces acting on solder paste during printing, explain how you would expect the squeegee pressure required for a good print to be affected by the speed and angle of the squeegee.
Compare your explanation with that given in the next two sections.
To get the aperture full of paste requires both a sufficient flow rate and a sufficient fill time. Apertures which are not completely filled will not release paste onto the board, usually resulting in clogged stencils, and defective solder joints.
The flow of the paste depends on the pressure gradient, the paste viscosity, and the dimensions of each aperture. The smaller the opening, the higher the pressure required to press the paste through it. The hydrodynamic pressure depends on two things.
A typical squeegee speed is in the range 10–100 mm.s−1, with slower speeds needed for small apertures. When fine-pitch parts are to be assembled, a typical speed has been 25 mm.s−1 – the time taken by the print stroke is often a factor limiting the capacity of a SM assembly line. For this reason, pastes with improved printability are being developed, which allow higher speeds, and give increased machine throughput: the latest pastes claim to be printable at speeds as high as 200 mm.s−1.
As well as being affected by squeegee pressure and speed, levelling is influenced by the squeegee angle. A smaller angle will increase the lifting force, and increased squeegee pressure is needed to overcome this.
The downward force on the squeegee is typically in the range 2–8 N.cm−1 of squeegee length, the value depending on the printing conditions, and in particular the squeegee speed.
Other influences on the printing behaviour are the squeegee hardness and the stencil surface finish – a slightly rough surface is considered useful to promote paste rolling during printing.
For on-contact (stencil) printing, paste release is determined by the separation speed of the board from the stencil. The adhesion of the paste on the board has to provide the shearing force to overcome the adhesion of the paste to the stencil walls. This hydrodynamic shearing force depends on the separation speed. Board release speed is typically a few mm.s−1. As with filling, it is the release of fine-pitch apertures which is the limiting factor in the printing process.
Draw a table showing the main machine parameters which affect each of the four activities in the stencil printing process (rolling, filling, levelling, and separation). Which of these are inter-related?
For printing through fine-pitch apertures, to reduce scooping and improve solder release, it is advantageous to print along the length of the aperture rather than across its width. The only possible compromise for a four-sided package is to position it at an angle to the direction of squeegee movement, but to require layouts to be designed with the larger ICs at such an angle is not acceptable.
Vector printing, in which the travel of the squeegee is at an angle to the normal X-Y board (and stencil) directions, allows the user to adopt variable positioning (generally 45°) without altering the board layout. This can be achieved either by rotating the board and stencil under a (fixed) squeegee assembly (MPM), or by swivelling the squeegee above the (fixed) board and stencil (DEK). In the first machine, there are alignment implications; in both, the useable stencil area is reduced for a given size of stencil frame.
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Conventional stencil printing techniques have fundamental limitations as regards paste handling:
The result is that, over the last decade, there have been many attempts to produce a viable sealed-paste print system. These attempts have accelerated since 1997/8, as there has been substantial focus on such methods as solutions to the challenges of high production rate printing.
The most fundamental constraint for fast printing is that the hydrostatic pressure in the paste is determined by the squeegee speed, but there are other considerations:
Sealed head, pressure printing systems take subtly different approaches to the design challenges of:
However, there are a number of features common to all systems:
The first of these heads to be launched was the DEK ‘ProFlow DirEKt Imaging’ head shown schematically in Figure 13.
The paste is supplied in a cassette, conceptually like a printer toner cartridge.
The Multicore Direct Imaging System Cassette shown is that company’s implementation of what is an open standard, which anyone can adopt without licence payment. The cassette holds 1.25kg of paste (substantially more than a standard cartridge) and is emptied through the holes on its top surface, which are sealed with removable tape when supplied. The collapsible plastic pouch which forms the body is flexible, which allows for a degree of manual kneading of the paste if desired.
The cassette base-plate is an integral part of the paste conditioning system, the holes in it working in conjunction with those on the transfer head to create a meander path for paste conditioning.
During the print stroke, the paste is pressurised by a piston which acts directly on the top surface of the plastic pouch of the paste cassette, keeping the conditioning chamber constantly supplied. At the end of the print stroke, pressure is removed from the system.
Whilst travelling across the stencil, the trailing wiper foil of the paste retention system ‘scoops’ the paste from the stencil surface, keeping the stencil surface clean and also inducing a rolling motion within the conditioning chamber, to help maintain the paste in optimum condition for printing.
The MPM system uses standard paste cartridges. As the pump head moves across the stencil, pneumatic pressure and friction between paste and stencil combine to cause the paste to roll inside the paste chamber, as shown in Figure 14. The circular shape of the chamber enhances paste rolling and eliminates ‘dead spots’ in the head.
Paste is ‘pumped’ into the stencil aperture onto the circuit board pad, then sheared from the main body of paste by the trailing edge blade. The blades on this head are mounted at 45° and made of specially coated metal, using Permalex technology from Transition Automation.
The MPM head has closed-loop feedback from the paste chamber to control the pressure applied to the paste feed. Capacitative sensors prompt the operator to supply additional paste when the cartridge level is low.
As with DEK, considerable effort has been put into the design and materials of the ‘side dams’, which fill the spaces between the two blades. The challenge is to eliminate paste wastage and build up of paste at the sides. MPM side dams are now made of a composite polymer material with improved wear characteristics, and the side dam pocket has been relieved to conform better to the blades. At the same time the blade and backup bar have been repositioned to protect blades from being damaged and provide better blade support at their interface with the side dam.
A key enhancement in the MPM system has been the development of the Variable Volume Actuator, designed to stop paste bleeding out of the pump at the end of the print stroke. The sequence of operation is:
You may notice that this is comparable to the technique used on some Archimedean dispense heads, where a small reverse action at the end of the stroke is used to stop droplet formation at the tip and possible ‘dribbling’.
As with dispensing, care has to be taken in material selection – not all pastes benefit from an enclosed chamber! In fact, certain paste formulations will even harden over time, this cold welding of the particles possibly being caused by a combination of a chemical reaction and the paste being pressurized. Also, depending on the head design, the paste may roll faster in the chamber than with squeegee blades, causing some paste formulations to shear thin faster than normal. On the positive side, however, costly agents added to extend paste life on the stencil may no longer be necessary.
Priming is the equivalent of initially charging the stencil before first use. Typically this is carried out away from the printer, with a removable sole plate in place, and with the head inverted to ensure that any trapped air is evacuated. When the print orifice is completely full, the head is primed and can be inverted and positioned on the stencil. Then, as with squeegees, sealed heads may take two or three passes initially for optimum print settings to be achieved.
All the designs allow for removal and storage, so that the paste can be removed from the printer, resealed and stored under optimum conditions during intermittent printing.
Cleaning the head can present some difficulties, generally requiring mechanical paste removal followed by immersion in cleaning fluid. The ease of cleaning varies between designs: for example, the MPM head has a push rod which extrudes paste from the chamber.
With the traditional squeegee, different sizes of board are accommodated by selecting a squeegee and applying the appropriate extruded length and volume of paste from the cartridge so that the paste roll is around 25-50mm wider than the board. Where necessary, polymer squeegees can even be cut to length. With sealed paste systems, this becomes impracticable, so heads are supplied in different widths.
As with squeegees, a skim of paste on the surface may be left on any unsupported areas and there can be more side overlap between head and pattern, especially with fixed sizes of head. In addition, the paste contact area is much greater, with the result that there is a higher total downward force on the board. For these reasons, the board generally needs to be supported better and over a wider area than with squeegee printing. Where a rail system is used for holding the board, tooling has to support the print head at each end of its stroke.
DEK experience suggests that there are two differences between sealed paste systems and conventional squeegee printing.
Tests have suggested that pressure printing can be carried out more repeatably at the higher print speed range of the paste. However, like printing with squeegee blades, the speed attainable is directly dependent upon the type of paste being used. Higher viscosity pastes may require lower print speeds and possibly higher print pressure.
Typically, improved filling pressure means that fine pitch parts can be printed at higher speed, giving higher throughput, although the rate remains material dependent. Faster cycling is also aided by:
Of the other advantages claimed by sealed paste systems over conventional squeegee printing, maintained solder paste quality and reduced paste wastage is the most substantial and immediately quantifiable benefit. Because the paste doesn’t come into contact with air, there is no drying out and crusting of paste on the stencil, and little waste during changeover, shift-change, clean-up and down-time. Although the actual performance will depend on batch sizes and printer idle time, scrap figures in the range 0.5% to 2% have been reported, as against as much as 30-50% for conventional squeegee printing.
Not only is there a direct cost saving, but the costs of disposing of hazardous waste are cut, and operator exposure to solder materials and solvents minimised. A valid point has also been made that the reduced amount of superfluous paste leads to a cleaner, safer printer and generally results in a reduced requirement for maintenance.
Other advantages include:
What advantages would you expect to get if your assembly house announced that they had just purchased a pressure-printing system? And what changes might you as a designer need to make?.
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