List of topics

In the table below are links to an increasing number of “topics”. These represent material that has either been extracted from units in order to reduce their length, or else provided to give supplementary and explanatory information. The topics come from a number of sources, and are very variable in length: some are just half a page of information, or a diagram; other topics have video material, SAQs and answers, and are completely self-standing. The parallel routes along which topics have evolved mean that they are not mutually exclusive, so there may be some overlap, and some topics may be seen to have been extracted from other longer scripts.

Readers should bear in mind that the material is very variable in terms of its creation date, so should not assume that the content represents the very latest information on a subject. If you need informal advice as to the status of any topic, please contact the owner. This is particularly important if you plan to refer to the material in your own course, because topic material may be significantly revised without warning.

The owners identified are generally the authors of the topic material, though in some cases original material was created by others. If you look at the document HTML, sometimes (but not always) information on the source and revision history is contained within an editable head section. In the list below, owners are identified by their initials: RH = Ron Hood, MT = Martin Tarr.

Note that all these materials are copyright The University of Bolton, with the authors retaining their moral right to be associated with their work.

One topic worthy of comment is the glossary at this link. The attempt was to create a number of pages arranged alphanumerically, that would cover the terms used in AMI teaching. To date they contain mainly material reflecting aspects of electronics manufacturing and board layout, with only a restricted amount of information on other subject areas. Martin Tarr would be pleased to hear from those wishing to contribute other definitions or useful links.

General topics
    Glossary of terms used in electronics MT
Using mind-mapping MT
Using web resources MT
Design issues in electronics
Effect of component choice on board design MT
Guide to using Graphicode GC-Prevue MT
New Product Introduction tools MT
The DfX concept MT
Electronics Materials
  Basic principles of materials
Coefficient of Thermal Expansion MT
Conductors and insulators MT
Dielectric properties MT
Elastic, viscous and viscoelastic materials
Mechanical properties of metals MT
Metals basics MT
Microstructure of surfaces MT
Stress and its effect on metals MT
Stress caused by thermal mismatch MT
The ‘homologous’ temperature MT
  Electronic materials
A component review MT
Ceramic components MT
Ceramics and glasses MT
Classes of component MT
Die bond materials MT
Electrolytic capacitors MT
Film processes for polymers MT
Getting the right part MT
Inductive components MT
Introduction to components MT
Other passive components MT
Polymer basics MT
Polymer materials and properties MT
Polymer types MT
Semiconductor packages MT
  Printed circuit boards
Alternative board materials MT
Application methods and their influence on solder mask processing MT
Basic board materials MT
Build information on a PCB MT
Selecting a board finish MT
Conductor finishes: nickel-gold MT
Conductor finishes: tin-lead MT
Immersion silver MT
Immersion tin MT
Organic board coatings MT
Properties of laminates MT
Solder mask design basics MT
Track resistance MT
Electronics manufacturing
  Assembly processes
Component insertion MT
ICT fixtures MT
Intrusive reflow MT
Panels and de-panelling MT
Repair and rework MT
Selective machine soldering MT
SM component placement MT
Solder paste printing MT
The In-Circuit Test sequence MT
Wave soldering MT
  Common processes
Dispensing MT
Is your board clean? MT
Making mouldings MT
Photoimaging MT
Plating MT
Polymer health and safety issues MT
Screen and stencil printing MT
To clean, or not to clean? MT
Underfilling MT
  ESD control
Electrostatics explained MT
ESD awareness MT
ESD control during manufacture MT
Modelling ESD waveforms MT
  Semiconductor back-end processes
Alternatives for die separation MT
Bonding to the chip face MT
Plastic encapsulation for semiconductors MT
Semiconductor assembly practice MT
Semiconductor back-grinding MT
Semiconductor die bonding MT
Semiconductor die separation MT
Semiconductor finishing processes MT
Changes in solderability with time MT
Fluxes for soldering MT
Holes and voids MT
How joints are made MT
Inert soldering MT
Intermetallics MT
J alloy MT
Other solder-related failure causes MT
Pad design MT
Pin witness MT
Practical solder paste issues MT
Reflow soldering MT
Solder materials MT
Solder paste basics MT
Solder paste characteristics MT
Solder skips MT
Solderability MT
Solderability testing MT
Surface flatness MT
Surface tension effects MT
Surface wettability MT
Tombstoning MT
Traditional solder materials MT
Wave soldering problems MT
Environmental engineering
An ISO 14001 overview MT
Assembly waste MT
Board fabrication issues MT
Cleaning issues MT
Flame retardancy additives MT
Life Cycle thinking MT
Making green choices MT
PCB recycling issues MT
Re-use and re-cycling MT
Sustainable development MT
Use of energy MT
Interconnection methods
Beam leads MT
Chip-Scale Package MT
Conductive inserts MT
Conductive polymer systems MT
Connecting to PCBs MT
Crimping MT
Flexible and flex-rigid circuits MT
Flip-chips MT
Gluing components MT
Hermetic encapsulation MT
High-Density Interconnect MT
Insulation-displacement connectors MT
Press-fit connectors MT
Tape Automated Bonding MT
Thick film technology MT
Wire wrapping MT
Wires matter MT
Maths fundamentals
The Gradient of an Electrostatic Field RH
Electrostatic Divergence RH
Management issues
Benchmarking MT
Change management MT
Concurrent engineering MT
Learning curves MT
Poka-yoke MT
Requirements for an efficient NPI process MT
Risk management MT
Choosing a model MT
Linear and non-linear models MT
Pitfalls of modelling MT
Representing space and time in a numerical model MT
Physics fundamentals
Adhesion MT
Atoms and bonding MT
Conducting heat MT
Effects at liquid surfaces MT
Viscosity and flow MT
Reliability issues and failure mechanisms
Assessing product reliability MT
Board failures MT
Conductive Anodic Filaments MT
Corrosion MT
Derating MT
Electrical failure MT
Electrical protection MT
Electromigration MT
Estimating time-to-fail MT
Failure due to humidity MT
Failure in solder joints MT
Failure mechanisms in ceramic capacitors MT
Failure mechanisms in other components MT
Failure rate and MTBF MT
Hermetic package failure MT
Humidity protection MT
Improving reliability by screening MT
Ingress protection MT
Mechanical failure MT
Modelling failure rate MT
Moisture absorption MT
Protecting against mechanical failure MT
Simulating the real world in the test house MT
The “real world” MT
Tin pest MT
Tin whiskers MT
What is a failure? MT

Last edited 17 January 2007